Dangelmayer Associates LLC, Trusted ESD Programs Since 1978

July 2023

Time: Full Days, July 25, 26, 27

Instructors: ESD Dream Team - Dangelmayer Associates, LLC

Location: Elks at Bass Rocks in Gloucester, MA

More Info Online: Training Workshops
Info Page w/PDF Flyer & Registration

April 2020

Time: Full Days, April 7, 8, 9

Instructors: ESD Dream Team - Dangelmayer Associates, LLC

Location: Spark Technology Center, 700 West Park Avenue, Perkasie, PA 18944, USA

More Info Online: Info Page w/PDF Flyer & Registration

September 2019

Time: 1:00 p.m. - 4:30 p.m.

Instructor: Terry Welsher – Dangelmayer Associates, LLC

Location: Riverside Convention Center, Riverside, CA, USA

More Info Online: Registration will be available soon

Time: 8:30 a.m. - 4:30 p.m.

Instructor: Ted Dangelmayer – Dangelmayer Associates, LLC

Location: Riverside Convention Center, Riverside, CA, USA

More Info Online: Registration will be available soon

Time: 8:30 a.m. - 12:00 p.m.

Instructor: Terry Welsher – Dangelmayer Associates, LLC

Location: Riverside Convention Center, Riverside, CA, USA

More Info Online: Registration will be available soon

Time: 1:00 a.m. - 4:30 p.m.

Instructor: Ginger Hansel – Dangelmayer Associates, LLC

Location: Riverside Convention Center, Riverside, CA, USA

More Info Online: Registration will be available soon

Time: 1:00 a.m. - 4:30 p.m.

Instructor: Ginger Hansel – Dangelmayer Associates, LLC

Location: Riverside Convention Center, Riverside, CA, USA

More Info Online: Registration will be available soon

Time: 1:00 a.m. - 4:30 p.m.

Instructor: Ted Dangelmayer – Dangelmayer Associates, LLC

Location: Riverside Convention Center, Riverside, CA, USA

More Info Online: Registration will be available soon

May 2019

EOS/ESD Manufacturing Symposium in China: Technology and Best Practice Sharing to Help Control Static!

Time: 9:00 AM - 5:00 PM

Instructor: Terry Welsher, Dangelmayer Associates, LLC

Location: Hilton Garden Inn, Shanghai, China

More Info: More Info (PDF)

Time: 9:00 AM - 5:00 PM

Instructor: Terry Welsher, Dangelmayer Associates, LLC

Location: Hilton Garden Inn, Shanghai, China

More Info: More Info (PDF)

March 2019

Time: 5:30-7:30 PM

Instructor: Ted Dangelmayer – Dangelmayer Associates, LLC

Location: MIT Lincoln Laboratory, 3 Forbes Road, Lexington, MA 02421

Register Online: Online Registration Form

While most companies are acutely aware of the hazards of ESD (electrostatic discharge), few are aware that the ESD QMS (Quality Management System) Strategy is equally important as the technical requirements. This is especially true for the extreme ESD sensitivities of Class 0 since the trend toward Class 0 devices is escalating rapidly. Furthermore, most companies do not know what their device sensitivities are because 90% of IC datasheets do not include CDM (Charged Device Model) Sensitivity data. The absence of this data and the lack of understanding of ESD QMS best practices have reached a critical stage. S20.20 (ANSI/ESD S20.20) is the best industry standard available and is an excellent foundation for ESD QMS best practices programs. However, companies with advanced technologies have found they must customize the technical requirements of S20.20 and introduce sound ESD QMS practices to avoid unacceptable failure rates in the factory and field.
Join us for this interactive presentation and learn if you are at risk and how to establish a robust ESD QMS strategy. You will also learn how to obtain ESD CDM & HBM (Human Body Model) device sensitivity data as well as how to prepare for Class 0.

Ted Dangelmayer is the president of Dangelmayer Associates, LLC and has assembled an ESD consulting team consisting of the foremost authorities in virtually all ESD areas of both product design and manufacturing. He received the “Outstanding Contribution” award and the EOS/ESD Association, Inc. “Founders” award. He was president of EOS/ESD Association, Inc., chairman of the ESDA standards committee, and general chairman of the EOS/ESD Symposium. He has published two editions of his book, ESD Program Management, numerous magazine articles, and technical papers. Ted holds three patents and is iNARTE certified. He is currently president of the Northeast local chapter of EOS/ESD Association, Inc., a member of the ESDA education Council, ESDA Marketing Team, Advanced Technologies Team, Nominations Committee and ESDA Publicity Team.

The meeting is open to all with free pizza and salad.

Registration is free but required.

Go Directly to the Registration Form

• 5:30PM, Networking and Food
• 6:00PM, Opening and Announcements
• 6:10PM – ~7:30PM, Technical Presentation and Q&A

Meeting Information
This meeting will be held from 5:30-7:30 PM on Wednesday, 13 March 2019 at MIT Lincoln Laboratory, 3 Forbes Road, Lexington, MA 02421. There is no charge for the refreshments or presentation. You do not need to belong to the IEEE to attend this event; however, we welcome your consideration of IEEE membership as a career enhancing technical affiliation. Please register to attend by Friday, 8 March 2019 so we can plan the refreshments.

Directions to MIT Lincoln Laboratory, 3 Forbes Road, Lexington, MA:
• Take Route 128/I-95 to Exit 30B, Route 2A Westbound.
• At the first traffic light, turn left onto Forbes Road.
• Go to the end of the street.
• At the traffic circle, turn right.
• Go halfway around the traffic circle and turn into the parking lot for MIT Lincoln Laboratory.
• The main entrance is straight ahead, shared with "agenus".

Map and Directions

October 2018

Location: EOS/ESD Association, Inc. Online On Demand

Time: 11:00AM-12:30PM EST

Instructor: Terry Welsher, Dangelmayer Associates LLC

Register Online: Online Registration Form

Electrical Overstress (EOS) accounts for most of the electrical failures of devices that occur in factories and in the field. One EOS root cause, ESD, has received much attention in technical literature, standards bodies, and educational workshops and tutorials. It has been approached in a systematic manner which has resulted in relatively successful practices for design of robust devices and control procedures for the factory. However, the same cannot be said for the effects of the broader categories of electrical stresses that can be the root cause of electrical overstress.

These other root causes (over-voltage, over-current, over-power), when grouped together, are more prevalent causes of failure than ESD by a wide margin because of the lack of a coherent design and mitigation strategy. One of the main reasons for this is that EOS root causes are widely varied and extremely application dependent. As a result, no simple broad models for EOS have emerged comparable to HBM and CDM for ESD. Common device design practices have not been developed to the same extent, system level approaches tend to be ad hoc and responsibility for controlling potential sources in manufacturing tends to be diffused or non-existent.

In this webinar, we review the current status of work on EOS. This will include recent significant reports in the technical literature, work of standards and industry groups, and some recent interesting case histories. We will also explore the definitions of EOS and some related terms and attempt to clarify some common ways these terms are misused in literature and in failure analysis reports. “Rethinking” how we talk about EOS will help failure analysis, design and manufacturing work together to reduce EOS-induced failures (including ESD).

December 2017

Location: EOS/ESD Association, Inc. 7900 Turin Rd., Bldg. 3 Rome, NY 13440-2069, USA

Time: 1:00 PM - 4:30 PM

Instructor: Ted Dangelmayer, Dangelmayer Associates LLC

Register Online: Online Registration Form

Location: EOS/ESD Association, Inc. 7900 Turin Rd., Bldg. 3 Rome, NY 13440-2069, USA

Time: 8:30 AM - 12:00 PM

Instructor: Ted Dangelmayer, Dangelmayer Associates LLC

Register Online: Online Registration Form

September 2017

Location: Westin La Paloma Tucson, AZ, USA

Discussion Group Session: 11:50AM-12:25PM

Moderator: Matt Strickland, L3 Technologies, Inc.; Ted Dangelmayer, Dangelmayer Associates LLC

Register Online: Registration Form: Register before May 15th and save!

EOS/ESD Association, Inc. has over 75 published documents that cover a range of subjects with regard to ESD control. It can become overwhelming to those new to the ESD control world to determine how to apply certain documents in what situations. This tutorial is designed to be a forum to provide those responsible to implement ESD control programs an overview of a few important standards and how to apply them in the factory. This tutorial will discuss the background, purpose, usefulness and limitations of four of the many standards available from EOS/ESD Association, Inc.:

• ESD TR53-01-15 Compliance Verification Procedures
• ANSI/ESD STM11.11-2015 Surface Resistance Measurements of Static Dissipative Planar Materials

Location: Westin La Paloma Tucson, AZ, USA

Discussion Group Session:8:50AM-10:20AM

Moderator: Scott Ward, Texas Instruments, Inc.; Terry Welsher, Dangelmayer Associates, LLC

Register Online: Registration Form: Register before May 15th and save!

While attention to the root causes of electrical overstress (EOS) damage has increased in recent years, most of the focus has been on failures that occur in the field as opposed to device and board manufacturing and test. This discussion group will center on participants experience with EOS damage in manufacturing and actions they have taken to prevent future yield losses. The possibility of a comprehensive EOS Control Program will also be discussed.

Location: Westin La Paloma Tucson, AZ, USA

Discussion Group Session: 8:50AM-10:20AM

Moderator: Ted Dangelmayer, Dangelmayer Associates, LLC

Register Online: Registration Form: Register before May 15th and save!

The objective of this group discussion is to clarify confusion regarding CDM control methods for Class 0 ESD sensitive devices. The benefits of current discharge measurements, surface resistance, dissipative materials and avoidance of metal-to-metal contact will be explored. The limitations of industry standards will be discussed as well as the CDM considerations in the various standards

Location: Westin La Paloma Tucson, AZ, USA

Time: 2:35PM-3:05PM

Moderator: Ted Dangelmayer, Dangelmayer Associates, LLC

Register Online: Registration Form: Register before May 15th and save!

Evolving ionization technology provides new ionizer designs for static control, and test methods for these devices are needed. This session describes performance tests for air assist bar ionizers, soft X-ray (photon) ionizers, and an alternate method of room ionization. These test methods are proposed to augment existing industry standards.

Location: Westin La Paloma Tucson, AZ, USA

Time: 4:25PM-5:00PM

Moderators: Michelle Lam, IBM; Terry Welsher, Dangelmayer Associates, LLC

Register Online: Registration Form: Register before May 15th and save!

The internet of things (IoT) brings big data analytics, artificial intelligence, process, and everything networked together to gain business value and insight. In this talk, let’s imagine what ESD control of the future could look like as IoT technologies start to transcend and transform the electronic industrial landscape.

Location: Westin La Paloma Tucson, AZ, USA

Time: 8:30 a.m. - 4:30 p.m.

Instructors: Ted Dangelmayer, Ginger Hansel, Dangelmayer Associates, LLC

Register Online: Registration Form: Register before May 15th and save!

Compliance verification is one of the most important elements of ESD program management and there are many technical and administrative pitfalls that can be avoided. The attendee will learn not only how to make valid auditing measurements in accordance with ESD TR53 – Compliance Verification of ESD Protective Equipment and Materials, but also how to ecognize and avoid common pitfalls. Common instruments will be explained as well as the invalid test results that can result when they are used incorrectly. Advanced auditing techniques will also be covered that enable Class 0 devices to be handled successfully. There are many ways to administer effective compliance verification programs. Two successful examples will be presented that were developed independently by different companies. Hidden administrative pitfalls that often result in poor compliance will also be discussed. This tutorial will be highly interactive with live demonstrations, in-plant photographs, and compelling video clips. Students will be encouraged to ask questions and to participate in the discussions

Location: Westin La Paloma Tucson, AZ, USA

Time: 1:00 p.m. - 4:30 p.m.

Instructors: Terry Welsher, Dangelmayer Associates, LLC

Register Online: Registration Form: Register before May 15th and save!

This tutorial focuses on the basic calculations and techniques of use to the program manager and the ESD engineer. The content is at the introductory college pre-calculus and introductory college physics level set in the context of electrostatic discharge and its effects. It is suggested that the student gain some familiarity with these subjects prior to the tutorial. Topics covered include the electric force, the electric field and Coulombs law, electric potential, and voltage. Gauss’ Law is discussed as it relates to the electric field, induction, and the Faraday cup. The capacitance in Q = CV is used to explain charge sharing. RC decay is discussed as it relates to ESD discharge from humans, devices, wrist straps, and materials. After completing this course, the attendee should leave with a proper understanding of the differences among the calculations for peak current, power, energy, and threshold voltage for a simple device.

Location: Westin La Paloma Tucson, AZ, USA

Time: 8:30 a.m. - 10:00 a.m.

Instructor: Ted Dangelmayer, Dangelmayer Associates, LLC

Register Online: Registration Form: Register before May 15th and save!

Learn how to prepare for the “Perfect ESD Storm” that is brewing in the electronics industry. The trend towards extensive use of ultra-sensitive components (Class 0) and the widespread lack of charged device model (CDM) understanding are brewing the “Perfect ESD Storm.” It is no longer business as usual, and it can take up to two years to prepare. This tutorial is intended for professionals who have a basic understanding of ESD but are not fully aware of CDM control techniques or the industry trend toward extremely sensitive devices and the counter measures that are necessary. Learn the answers to your questions as well as these examples: Are you skeptical about this news of a Class 0 trend? Is it really happening? Is it likely to be a problem in your factory? How big a problem is CDM in manufacturing? What is different about CDM controls? How do I tailor ANSI/ESD S20.20 for CDM and Class 0? Join us for this highly interactive tutorial and learn why this is inevitable and how to prepare for it.

Location: Westin La Paloma Tucson, AZ, USA

Time: 8:30 a.m. - 12:00 p.m.

Instructor: Ginger Hansel, Dangelmayer Associates, LLC

Register Online: Registration Form: Register before May 15th and save!

The complexity of properly installing workstations is often underestimated. On the ‘surface’ it appears to be a simple installation of an ESD static dissipative mat or ESD hard laminate. However, there are important issues learned from years of experience that impact cost, durability, ESD performance, maintenance, and compliance verification. A good ESD control workstation is the cornerstone of ESD program management (EPM). Workstations used in processing ESD susceptible items are intended to maintain a near zero potential by providing ground paths for basic components of the workstation and a connection point for personnel grounding apparatus. The workstation should provide protection from charged device model (CDM) ESD as well as human body model (HBM). This practical tutorial will teach you how to set-up an effective ESD controlled workstation that accomplishes these goals. It will cover selection and qualification of the required materials and how to install them correctly. Other workstation issues will be discussed including: application of ionization, garment grounding, ESD chairs, handling containers, tools, and compliance verification consistent with ESD TR53.

Location: Westin La Paloma Tucson, AZ, USA

Time: 8:30 a.m. - 12:00 p.m.

Instructor: Jeff Dunnihoo, Pragma Design, Inc. & Dangelmayer Associates, LLC

Register Online: Registration Form: Register before May 15th and save!

This tutorial is intended to help those tasked with testing products to system level ESD standards by providing first an overview of how real-world system ESD events are simulated in different standards and testers in general, and then provide detailed information on IEC 61000-4-2, the most widely used standard. This introduction will highlight the similarities and differences between IEC, ANSI, Telcordia, and some automotive ESD standards. We will answer common questions regarding test setups, test points, and procedures, and address key issues, including: 1) differences between “verification” and “calibration” and when is each required; 2) test equipment requirements, the test environment, ground connections, return paths, and ground plane effects. 3) Testing procedures with demonstration on actual products, how the tester and procedure affects test results, and problems with test result variations due to simulator influences; 4) definitions of testing failure criteria for the product; 4) what points need to be tested and why, guidance on determining “operator accessible” points and ports, exempted points and ports, and what to do around connectors and connector pins. 5) ANSI and other ESD standards, the drive toward harmonization with IEC, the scope of different standards, and why they are unlikely to converge. This system level ESD tutorial will cover different perspectives on ESD as applied to electronic systems from the user’s, the designer’s, and even the designer’s competitor’s points of view.

Location: Westin La Paloma Tucson, AZ, USA

Time: 1:00 p.m. - 4:30 p.m.

Instructor: Ted Dangelmayer, Dangelmayer Associates, LLC

Register Online: Registration Form: Register before May 15th and save!

There are a number of common misunderstandings and controversies about electrostatic discharge (ESD) program management that can have significant impact on the implementation and maintenance of the ESD program. These misunderstandings or “myths” result in unnecessary expenditures and/or result in a compromise of the program integrity. These myths and controversies, such as latency, are often cited by skeptics not wanting to adhere to certain standard ESD procedures. As a consequence, it is important to identify and dispel the myths as well as to understand the potential impact of latent failures.

This tutorial highlights 10 common myths and supporting success studies as well as a success study in latency. The myths and success studies presented here were chosen to provide real-world examples of how an ESD program can be strengthened by understanding the fallacy in each of the myths. This understanding will result in more reliable products that are also more cost competitive. Although not a myth, latency is a significant reliability consideration that is surrounded with controversy. Some experts will argue that latency is virtually non-existent and others will claim that it is the dominant failure mode. Reality lies somewhere in between. The latency study cites irrefutable evidence of latent failures in alarming proportions that must be factored into ESD programs and product design.

June 2017

Location: Plaza Suites Hotel, 3100 Lakeside Drive, Santa Clara, CA, USA

Time: 8:30 a.m. - 12:00 p.m.

Instructor: Terry Welsher, Dangelmayer Associates

Register Online: Registration Form: Register before May 15th and save!

Advanced ESD controls and auditing measurements for CDM & Class 0 (ultra-sensitive) devices and circuit boards are not well known and there are many technical and strategic pitfalls that must be avoided. Industry definitions (threshold levels) for Class 0 will be described and the history of their use will be reviewed. The Class 0 category is broken down into sub-categories of increasing risk. Students will learn how to make valid measurements, avoid common pitfalls, and how to use this data to successfully handle Class 0 sensitivities. Advanced measurements will be described including event detection and high speed current measurements. Students will learn when each measurement type is useful. Compelling case studies will illustrate these techniques and the success they produce.

ESD Control procedures for Class 0 manufacturing require customization, attention to detail and a full understanding of the technology. Thus, each company will need to develop a Class 0 ESD subject matter expert (SME) to ensure the correct and cost effective counter measures are taken. SOPs (special operating procedures) developed by SMEs will be discussed that have proven to virtually eliminate Class 0 failures.

This tutorial will be highly interactive with live demonstrations, in-plant photographs, and video clips. Students will be encouraged to ask questions and actively participate in the discussions. References to technical literature on ultra-sensitive devices will be included.

Location: Plaza Suites Hotel, 3100 Lakeside Drive, Santa Clara, CA, USA

Time: 1:00 p.m. - 4:30 p.m.

Instructor: Terry Welsher, Dangelmayer Associates

Register Online: Registration Form: Register before May 15th and save!

Electrical overstress (EOS) is a major cause of device failure in manufacturing and in the field. Despite this, there is relatively little information on the sources of EOS and on prevention practices, particularly for the factory. In this tutorial, the fundamentals of device overstress are reviewed. Relationships among device EOS stressing models, such as the Wunsch-Bell curve, are discussed. The causes of EOS and EOS-like events in manufacturing are described and categorized by source and by stress-type. The difficulties in distinguishing between power-induced EOS and high current ESD events such as charged-board events (CBE) and cable discharge events (CDE) are discussed. Case histories, including failure analysis and root cause determination, are presented and the few relevant industry specifications are reviewed.

May 2017

Location: 2017 EOS/ESD Association, Inc. Texas Regional Tutorials - -> 3M Innovation Center, 6801 River Place Blvd., Austin, TX 78726

Time: 8:30 AM - 12:00 PM

Speaker: Ginger Hansel, Dangelmayer Associates LLC

Register: Registration Form

Accurate data is the foundation of effective ESD program management. This hands-on tutorial will explain and demonstrate the proper use of ESD test equipment such as static locators, resistance meters, charge plate monitors, and event detectors. We will examine pitfalls of using these common instruments that can result in an incorrect representation of the ESD risk. For example, static locators can give misleading readings if the effects of voltage suppression are not taken into account. We will also discuss the effective use of ionization since ionizers that are not measured, maintained, and located correctly may contribute ESD hazards to the work area. Each student will participate in class exercises to perform these tests. The hands-on experience is the best way to understand the seriousness of the pitfalls and the benefits to taking the proper precautions. What you learn will help you avoid frequent auditing problems and improve your compliance verification program.

Location: 2017 EOS/ESD Association, Inc. Texas Regional Tutorials - -> 3M Innovation Center, 6801 River Place Blvd., Austin, TX 78726

Time: 1:00 PM - 4:30 PM

Speaker: ed Dangelmayer, Dangelmayer Associates LLC

Register: Registration Form

The worldwide industry standard for static control programs, ANSI/ESD S20.20 undergoes review every 5 years. This time, the changes were numerous and the review process took almost 7 years. The current version was released in 2014. Companies who are certified to ANSI/ESD S20.20 - 2007 have until 2016 to comply with the 2014 version. The document changes, both editorial and technical, and their implications for users, will be discussed in this webinar. The changes will expand the use of some test methods or require new test methods and possibly new test equipment. These test methods as well as ANSI/ESD S20.20 capabilities will be discussed. Anyone involved with a static control program that is either compliant or certified to ANSI/ESD S20.20 will find important information in this webinar. Please download and read ANSI/ESD S20.20 - 2014 prior to attending the tutorial. Free download is avialable at https://www.esda.org/standards/factory/esd-control-program/view/1544

Topics that will be included:
1. Scope
2. Foreword
3. Tailoring Statement
4. Clarification: requirements vs. optional technical elements
5. Material Qualification Plan
6. Personnel grounding and Required walking test
7. Allowable Field Requirements
8. Ionization
9. Soldering irons
10. Packaging used as work surfaces
11. Requirements to Test Wrist Strap Connection Point

ANSI/ESD S20.20 New/Revised Test Methods
1. Walking Test Required
2. Measuring fields from small objects – electrostatic voltmeter
3. Measuring voltages on isolated conductors – High impedance contacting voltmeter
4. New Test Equipment That May be Necessary

Location: 2017 EOS/ESD Association, Inc. Texas Regional Tutorials - -> 3M Innovation Center, 6801 River Place Blvd., Austin, TX 78726

Time: 8:00 AM - 5:00 PM

Speaker: Ted Dangelmayer, Dangelmayer Associates LLC

Register: Registration Form

Compliance verification is one of the most important elements of ESD program management and there are many technical and administrative pitfalls that can be avoided. The attendee will learn not only how to make valid auditing measurements in accordance with ESD TR53 – Compliance Verification of ESD Protective Equipment and Materials, but also how to recognize and avoid common pitfalls. Common instruments will be explained as well as the invalid test results that can result when they are used incorrectly. Advanced auditing techniques will also be covered that enable Class 0 devices to be handled successfully. There are many ways to administer effective Compliance Verification programs. Two successful examples will be presented that were developed independently by different companies. Hidden administrative pitfalls that often result in poor compliance will also be discussed. This tutorial will be highly interactive with live demonstrations, in-plant photographs, and compelling video clips. Students will be encouraged to ask questions and to participate in the discussions

Location: 2017 EOS/ESD Association, Inc. Texas Regional Tutorials - -> 3M Innovation Center, 6801 River Place Blvd., Austin, TX 78726

Time: 8:00 AM - 5:00 PM

Speakers: Ted Dangelmayer, Terry Welsher, Dangelmayer Associates LLC

Register: Registration Form

This tutorial provides the foundation material for understanding electrostatics and ESD and their role in the manufacturing and handling of ESD sensitive devices. The fundamental properties of charge, electric fields, voltage, capacitance, and current are discussed with a view towards understanding key electrostatic phenomena and electrical processes. These include charge generation and decay, material properties, and induction. An overview of device failure mechanisms is presented, including how these models impact ESD control programs. Finally, the course provides an overview of ESD control procedures during handling and manufacturing and an overview of ANSI/ESD S20.20 program requirements. This full day course is required for those in-plant auditors and program managers who are working toward professional ESD certification. The presentation includes many in-class demonstrations, videos, and animated slides.

Some sample topics covered in this course are:
Definitions and relationships among important electrical and mechanical properties
Causes of charge generation and decay
Field effects and voltages
Role of capacitance in ESD (Q=CV)
Overview of key measurements including common pitfalls of some measurements
Review of ESD failure models
Understanding and demonstrating electrostatic induction
Utility and limitations of air ionization
Basic goals of ESD controls
Properties of effective ESD control products and materials
Overview of ANSI/ESD S20.20 ESD program development requirements

March 2017

Location: 2017 EOS/ESD Association, Inc. Texas Regional Tutorials - -> 3M Innovation Center, 6801 River Place Blvd., Austin, TX 78726

Time: 8:30 AM - 12:00 PM

Speaker: Terry Welsher, Dangelmayer Associates LLC

Register: Registration Form

Electrical overstress (EOS) is a major cause of device failure in manufacturing and in the field. Despite this, there is relatively little information on the sources of EOS and on prevention practices, particularly for the factory. In this tutorial, the fundamentals of device overstress are reviewed. Relationships among device EOS stressing models, such as the Wunsch-Bell curve, are discussed. The causes of EOS and EOSlike events in manufacturing are described and categorized by source and by stress-type. The difficulties in distinguishing between powerinduced EOS and high current ESD events such as charged-board events (CBE) and cable discharge events (CDE) are discussed. Case histories, including failure analysis and root cause determination, are presented and the few relevant industry specifications are reviewed.

Location:2017 EOS/ESD Association, Inc. Texas Regional Tutorials - -> 3M Innovation Center, 6801 River Place Blvd., Austin, TX 78726

Time: 1:00 PM - 4:30 PM

Speaker: Terry Welsher, Dangelmayer Associates LLC

Register: Registration Form

Advanced ESD Controls and Auditing Measurements for CDM & Class 0 (ultra-sensitive) devices and Circuit Boards are not well known and there are many technical and strategic pitfalls that must be avoided. Industry definitions (threshold levels) for Class 0 will be described and the history of their use will be reviewed. The Class 0 category is broken down into sub-categories of increasing risk. Students will learn how to make valid measurements, avoid common pitfalls, and how to use this data to successfully handle Class 0 sensitivities. Advanced measurements will be described including event detection and high speed current measurements. Students will learn when each measurement type is useful. Compelling case studies will illustrate these techniques and the success they produce. ESD Control procedures for Class 0 manufacturing require customization, attention to detail and a full understanding of the technology. Thus, each company will need to develop a Class 0 ESD subject matter expert (SME) to ensure the correct and cost effective counter measures are

November 2016

Location: EOS/ESD Manufacturing Symposium in China, Xian, Shaanxi Province, China

Time: 9:30 – 9:55am

Speaker: Arnold Steinman, Electronics Workshop, Dangelmayer Associates

Register: Register Online

Technical Presentation 2
Measurement Methods and Air Ionization Affected by Manufacturing Changes
Arnold Steinman, Electronics Workshop, Dangelmayer Associates

Manufacturing has brought increased semiconductor device functionality through smaller geometries, larger wafer sizes, and faster operating speeds, as well as increased disk drive storage density. It has also resulted in lower ESD withstand voltages for products. Measurements are needed to assure that the manufacturing process can safely handle these products. To produce these advanced technologies the use of air ionization for static control has changed. This paper explores measurement methods for process risk assessment and new ionization requirements.

October 2016

Location: MIT Lincoln Laboratory, 3 Forbes Road, Lexington, MA 02421

Time: 5:30 PM Networking, 6:00 PM Presentation Begins

Speaker: Ginger Hansel, Director of ESD Program Management, Dangelmayer Associates LLC

Register: Register Online

September 2016

Location: Hyatt Regency Orange County Garden Grove (Anaheim), CA, USA

Speakers & Time:

1. Sunday, ESD Basics for the Program Manager: 8:00 a.m. - 5:00 p.m. Ted Dangelmayer and Terry Welsher of Dangelmayer Associates LLC
2. Monday, NEW/REVISED DD/FC130: System Level ESD/EMI: Testing to IEC & Other Standards 8:30 a.m. - 12:00 p.m. Jeff Dunnihoo, Pragma Design, Inc.
3. Monday, September 12 FC360: Electrical Overstress (EOS) in Manufacturing and Test 8:30 a.m. - 12:00 p.m. Terry Welsher, Dangelmayer Associates LLC
4. Monday, FC120: Air Ionization Issues and Answers for the Program Manager 8:30 a.m. - 12:00 p.m. Arnold Steinman, Electronics Workshop, Dangelmayer Associates LLC
5. Monday, NEW DD/FC155: ESD Control Workstations: Set-up, Practical Considerations and Measurements 1:00 p.m. - 4:30 p.m. Ginger Hansel, Dangelmayer Associates LLC
6. Thursday, September 15 FC361: Class 0A Devices & Boards - ESD Controls and Auditing Measurements 8:30 a.m. - 12:00 p.m. Terry Welsher, Dangelmayer Associates LLC

Register: Register Online

PDF Flyer: Download PDF Flyer

June 2016

Location: Plaza Suites Hotel, 3100 Lakeside Drive, Santa Clara, CA, USA

Speakers: Ted Dangelmayer and Terry Welsher of Dangelmayer Associates LLC

Time: 8:00 a.m. - 5:00 p.m.

Register: Register Online

PDF Flyer: Download PDF Flyer

Essentials for ESD Programs Factory: Technologies • Controls • Procedures

This two-day seminar consists of concentrated versions of the 10 ESDA tutorials which comprise the ESDA
Program Manager (PrM) Certification Program:

• ESD Basics for the Program Manager
• Ionization and Answers for the Program Manager
• Packaging Principles for the Program Manager
• System Level ESD/EMI: Testing to IEC and other Standards
• Cleanroom Considerations for the Program Manager
• How To’s of In-Plant ESD Survey and Evaluation Measurements
• Device Technology and Failure Analysis Overview
• Electrostatic Calculations for the Program Manager and the ESD Engineer
• ESD Standards Overview for the Program Manager
• ESD Program Development & Assessment (ANSI/ESD S20.20 Seminar)

May 2016

Sponsored by: Shenzhen Best-Resource Consulting Services Ltd.

Location: Floor 5-7, Block B, Funing Hi-Tech Industrial Park, No.71-2 Xintian Rd, Fuyong Town, Baoan District, Shenzhen, China.

Speakers: Terry Welsher of Dangelmayer Associates LLC

Time: 9:00 a.m. - 5:00 p.m.

THURSDAY, MAY 26 2016

FC361: Class 0A Devices & Boards - ESD Controls and Auditing Measurements

8:30 a.m. - 12:00 p.m.

Instructor: Terry Welsher, Dangelmayer Associates LLC

Advanced ESD Controls and Auditing Measurements for CDM & Class 0 (ultra-sensitive) devices and Circuit Boards are not well known and there are many technical and strategic pitfalls that must be avoided. Industry definitions (threshold levels) for Class 0 will be described and the history of their use will be reviewed. The Class 0 category is broken down into sub-categories of increasing risk. Students will learn how to make valid measurements, avoid common pitfalls, and how to use this data to successfully handle Class 0 sensitivities. Advanced measurements will be described including event detection and high speed current measurements. Students will learn when each measurement type is useful. Compelling case studies will illustrate these techniques and the success they produce.

ESD Control procedures for Class 0 manufacturing require customization, attention to detail and a full understanding of the technology. Thus, each company will need to develop a Class 0 ESD subject matter expert (SME) to ensure the correct and cost effective counter measures are taken. SOPs (Special Operating Procedures) developed by SMEs will be discussed that have proven to virtually eliminate Class 0 failures.

This tutorial will be highly interactive with live demonstrations, in-plant photographs, and video clips. Students will be encouraged to ask questions and actively participate in the discussions. References to technical literature on ultra-sensitive devices will be included.

 

FC360: Electrical Overstress (EOS) in Manufacturing and Test

1:00 p.m. - 4:30 p.m.

Instructor: Terry Welsher, Dangelmayer Associates L.L.C.

Electrical overstress (EOS) is a major cause of device failure in manufacturing and in the field. Despite this, there is relatively little information on the sources of EOS and on prevention practices, particularly for the factory. In this tutorial, the fundamentals of device overstress are reviewed. Relationships among device EOS stressing models, such as the Wunsch-Bell curve, are discussed. The causes of EOS and EOS-like events in manufacturing are described and categorized by source and by stress-type. The difficulties in distinguishing between power-induced EOS and high current ESD events such as charged-board events (CBE) and cable discharge events (CDE) are discussed. Case histories, including failure analysis and root cause determination, are presented and the few relevant industry specifications are reviewed.

For More Information:Go to PDF Flyer

May 2015

Location: Teradyne Conference Center 600 Riverpark Drive, North Reading, MA

Speakers: Ted Dangelmayer, Terry Welsher & Ginger Hansel all of Dangelmayer Associates LLC

Time: 8:30am - 4:30pm

Tutorials:

• [MAY 19, 2015, 8:30 a.m. - 4:30 p.m.] FC100: ESD Basics for the Program Manager
  • This tutorial provides the foundation material for understanding electrostatics and ESD and their role in the manufacturing and handling of ESD sensitive devices. The fundamental properties of charge, electric fields, voltage, capacitance, and current are discussed with a view towards understanding key electrostatic phenomena and electrical processes. These include charge generation and decay, material properties, and induction. An overview of device failure mechanisms is presented, including how these models impact ESD control programs. Finally, the course provides an overview of ESD control procedures during handling and manufacturing and an overview of ANSI/ESD S20.20 program requirements. This full day course is required for those in-plant auditors and program managers who are working toward professional ESD certification. The presentation includes many in-class demonstrations, videos, and animated slides.
• [MAY 20, 2015, 8:30 a.m. - 4:30 p.m.] FC101: How To’s of In-Plant ESD Auditing and Evaluation Measurements
  • This program reviews the evaluation and periodic verification (audit) measurement procedures for the technical requirements specified in the ANSI/ESD S20.20 ESD program development standard. Detailed explanation of instruments, fixtures, and accessories function and usage are provided. Then, the details of “How to” measure are explained and demonstrated. Measurements include those listed in Table 1: Grounding/Equipotential Bonding Requirements; Table 2: Personnel Grounding Requirements; and Table 3: EPA/ESD Control Items. These recommended measurement procedures confirm the proper operation and use of ESD control products and materials selected as part of a facility’s S20.20 ESD control program.
• [MAY 21, 2015, 8:30 a.m. - 12:00 p.m.] ESD Models and Test Methods
  • The familiar Human-Body Model (HBM) and Charged-Device Model (CDM) are commonly used simplifications of ESD events which have been employed in the electronics industry to characterize the vulnerability of devices to ESD events in production. Standard test methods have been adopted by the electronics industry based on these models. In many cases, HBM withstand thresholds are available on device data sheets. However, IC suppliers generally fail to put CDM withstand voltages on datasheets. These data can be used to set requirements on suppliers, classify components and manage levels of ESD control in production. However, the limits and applicability of these models are not widely understood. Some aspects of the models are arbitrary and in a given failure scenario may not be the best representation of a damaging event. Also other models (or events) are also gaining use and acceptance in the industry such as the Charged-Board Event (CBE) and Cable Discharge Event (CDE). Other models such as the so-called Machine Model (MM) are being phased out. Finally, system designers have been attempting to apply system ESD models such as IEC 61000-4-2 at the device level in ways that do not produce useful results and can be counter-productive. In this webinar, we review the basis for all these models and relationships among them. We will discuss the use of device classifications in designing production control programs and when and how to use (and not use) the various models.
• [MAY 21, 2015, 1:00 p.m. - 4:30 p.m.] FC150: Hands-on ESD Measurements & Instruments-Uses and Pitfalls
  • The familiar Human-Body Model (HBM) and Charged-Device Model (CDM) are commonly used simplifications of ESD events which have been employed in the electronics industry to characterize the vulnerability of devices to ESD events in production. Standard test methods have been adopted by the electronics industry based on these models. In many cases, HBM withstand thresholds are available on device data sheets. However, IC suppliers generally fail to put CDM withstand voltages on datasheets. These data can be used to set requirements on suppliers, classify components and manage levels of ESD control in production. However, the limits and applicability of these models are not widely understood. Some aspects of the models are arbitrary and in a given failure scenario may not be the best representation of a damaging event. Also other models (or events) are also gaining use and acceptance in the industry such as the Charged-Board Event (CBE) and Cable Discharge Event (CDE). Other models such as the so-called Machine Model (MM) are being phased out. Finally, system designers have been attempting to apply system ESD models such as IEC 61000-4-2 at the device level in ways that do not produce useful results and can be counter-productive. In this webinar, we review the basis for all these models and relationships among them. We will discuss the use of device classifications in designing production control programs and when and how to use (and not use) the various models.

PDF Flyer: ESDA Regional Tutorial Flyer w/registration info (PDF)

Registration: ESDA On-Line Registration

January 2015

Time: 5:30 p.m. - 7:30 p.m.

Location: MIT Lincoln Laboratory, 244 Wood Street Lexington, MA 02420

Speakers: Ted Dangelmayer, Dangelmayer Associates LLC

Co-Sponsors: IEEE Reliability, Boston Chapter and ESDA Northeast Chapter

Registration: Please Register by Monday January 12th BY NOON, so we can finalize the arrangements!

Abstract: “Class 0 and Reliability ESD Case Studies”
Join us for this highly interactive tutorial and learn about reliability failures including latency as well as the complexity, customization and attention to detail required to successfully produce products utilizing ultra-sensitive Class 0 devices. Start to understand these issues now because there will be no "Class 0 Standard Practices" in the foreseeable future. The variables and complexity are far too great. Case studies will include medical reliability failures, latency, production and military program stoppage, CCD installations, and MR heads...

• Agenda:
• 5:30-6:00 Sign In & Personal Networking, Light dinner & refreshments
• 6:00-6:15 Greetings, monthly meeting announcements, guest presenter introduction
• 6:15-7:15 Ted Dangelmayer - Dangelmayer Associates, LLC
• 7:15-7:30 Q&A session, meeting adjourns

As always, IEEE members & nonmembers are welcome, the meeting & food is free of charge.

For This event, we Require you register in advance, so we can finalize food / drink arrangements.

The registration deadline for this meeting is: Monday January 12th 2015 @ NOON

May 2014

Time: 8:30 a.m. - 4:30 p.m.

Location: Teradyne Conference Center 600 Riverpark Drive • North Reading, MA

Speakers: Ted Dangelmayer & Terry Welsher, Dangelmayer Associates LLC

Tutorial Co-Sponsors: ESDA and ESDA Northeast Chapter

Information and registration: ESDA Northeast Chapter or download the RTP Flyer: PDF Flyer

Advanced ESD Controls and Auditing Measurements for CDM & Class 0 (ultra–sensitive) devices and Circuit Boards are not well known and there are many technical and strategic pitfalls that must be avoided. Industry definitions (threshold levels) for Class 0 will be described and the history of their use will be reviewed. The Class 0 category is broken down into sub–categories of increasing risk. Students will learn how to make valid measurements, avoid common pitfalls and how to use this data to successfully handle Class 0 sensitivities. Advanced measurements will be described including event detection and high speed current measurements. Students will learn when each measurement type is useful. Compelling case studies will illustrate these techniques and the success they produce.

ESD Control procedures for Class 0 manufacturing require customization, attention to detail and a full understanding of the technology. Thus, each company will need to develop a Class 0 ESD subject matter expert (SME) to ensure the correct and cost effective counter measures are taken. SOPs (Special Operating Procedures) developed by SME’s will be discussed that have proven to virtually eliminate Class 0 failures.

Class Exercises will allow each student to make advanced measurements necessary for Class 0. They will also experience common measurement the pitfalls and how to avoid them.

This tutorial will be highly interactive with live demonstrations, in-plant photographs, and video clips. Students will be encouraged to ask questions and actively participate in the discussions. References to technical literature on ultrasensitive devices will be included.

March 2014

Time:5:30 PM

Location: MIT, Lexington

Speaker: Jeff Dunnihoo, Dangelmayer Associates & Pragma Design

Sponsors: Meeting of ESDA Northeast Chapter & IEEE Reliability

While there are numerous solutions for characterizing and qualifying ESD transient robustness levels and hard–failures, there are extremely limited options for soft-failure, or “ESD upset” root-cause identification and analysis.

Pulse simulator systems have been developed by the industry with reasonable repeatability for product characterization and qualification. However, these techniques were never intended for use by the system design engineer as root–cause analysis and debug tools.

We will discuss in detail a new solution to this problem that has adapted EMI/EMC 3D scanning systems in conjunction with injected pulse generator simulators in both “current reconstruction” and transient susceptibility scanning modes. These systems attempt to identify which individual components and nodes actually “feel” the residual and induced transient pulses, how much, and to what effect.

We will also present some reconstructed animations of measured ESD charge distribution during a strike on an actual system board, along with some case studies and take a look toward the future of ESD scanning/reconstruction technology, including Embedded ESD Scanning as described in this recent EDN article.

February 2014

Time:February 26 & 27, 2014, 8:30 a.m. – 4:30 p.m.

Location: EOS/ESD Association Inc., 7900 Turin Rd Bld 3, Rome NY 13440

Instructors: Ted Dangelmayer, Dangelmayer Associates LLC; Carl Newberg, MicroStat Laboratories, Dangelmayer Associates LLC

Sponsors: ESDA

PDF Flyer: http://www.dangelmayer.com/Feb2014RTPRomeNY.pdf

Feb 26

This tutorial provides the foundation material for understanding electrostatics and ESD and their role in the manufacturing and handling of ESD sensitive devices. The fundamental properties of charge, electric fields, voltage, capacitance, and current are discussed with a view towards understanding key electrostatic phenomena and electrical processes. These include charge generation and decay, material properties, and induction. An overview of device failure mechanisms is presented, including how these models impact ESD control programs. Finally, the course provides an overview of ESD control procedures during handling and manufacturing and an overview of ANSI/ESD S20.20 program requirements. This full day course is required for those in-plant auditors and program managers who are working toward professional ESD certification.

The presentation includes many in-class demonstrations, videos, and animated slides. Some sample topics covered in this course are:

• Definitions and relationships among important electrical and mechanical properties
• Causes of charge generation and decay
• Field effects and voltages
• Role of capacitance in ESD (Q=CV)
• Overview of key measurements including common pitfalls of some measurements
• Review of ESD failure models
• Understanding and demonstrating electrostatic induction
• Utility and limitations of air ionization
• Basic goals of ESD controls
• Properties of effective ESD control products and materials
• Overview of ANSI/ESD S20.20 ESD program development requirements

Note

This class is part of the Program Manager Certification curriculum. More details on the Professional Certification Programs offered by ESDA are on our website at www.esda.org/certification.html.

Feb 27

Compliance verification is one of the most important elements of ESD program management and there are many technical and administrative pitfalls that can be avoided. The attendee will learn not only how to make valid auditing measurements in accordance with ESD TR53 – Compliance Verification of ESD Protective Equipment and Materials, but also how to recognize and avoid common pitfalls. Common instruments will be explained as well as the invalid test results that can result when they are used incorrectly. Advanced auditing techniques will also be covered that enable Class 0 devices to be handled successfully. There are many ways to administer effective Compliance Verification programs. Two successful examples will be presented that were developed independently by different companies. Hidden administrative pitfalls that often result in poor compliance will also be discussed. This tutorial will be highly interactive with live demonstrations, in-plant photographs, and compelling video clips. Students will be encouraged to ask questions and to participate in the discussions

January 2014

Time:TBA

Location: TBA

Speaker: TBA

Sponsors: Meeting of ESDA Northeast Chapter

 

November 2013

Time:5:30 p.m.

Location: MIT Lincoln Laboratory, 244 Wood Street, Lexington, MA 02420

Speaker: Ted Dangelmayer, Dangelmayer Associates L.L.C.

Sponsors: Joint Meeting of ESDA Northeast Chapter and IEEE Reliability Chapter

While most companies are acutely aware of the hazards of ESD (electrostatic discharge), few are aware of how to handle the extreme sensitivities of ESD Class 0 devices or if they are at risk of quality or reliability failures. Others are unaware of device trends towards these ultra-sensitive components and the resulting reductions in IC device design target levels.

Join us for this highly interactive presentation and learn if you are at risk and also about the complexity, customization and attention to detail required to successfully produce products utilizing Class 0 devices. You will also learn how to classify Circuit Board Assemblies that contain Class 0 components. ESD Class 0 Case Studies will be presented such as when 100% failure rates brought production to a standstill during ramp up of a one Billion dollar product line. Another Case Study documents 22% failures rates with a good S20.20 program in place.

If you are waiting for a Class 0 industry standard, it is unlikely that any standards body will be able to develop a "Class 0 Standard Process" in the foreseeable future. The variables and complexity are far too great.

October 2013

Time:TBA a.m. - p.m.

Location: Rio All Suites, Las Vegas, NV

Speaker: Ted Dangelmayer, Dangelmayer Associates L.L.C.

Sponsors: 35th Annual EOS/ESD Symposium and Tutorials

More info to be posted. Also go to: http://esda.org/symposiaEOS-ESD.html

September 2013

Time:TBA a.m. - p.m.

Location: Rio All Suites, Las Vegas, NV

Speaker: Ted Dangelmayer, Dangelmayer Associates L.L.C.

Sponsors: 35th Annual EOS/ESD Symposium and Tutorials

More info to be posted. Also go to: http://esda.org/symposiaEOS-ESD.html

Time:TBA a.m. - p.m.

Location: Rio All Suites, Las Vegas, NV

Speaker: Al Wallash, Dangelmayer Associates L.L.C.

Sponsors: 35th Annual EOS/ESD Symposium and Tutorials

More info to be posted. Also go to: http://esda.org/symposiaEOS-ESD.html

Time: 8:30 a.m. - 12:00 p.m.

Location: Rio All Suites, Las Vegas, NV

Speaker: Arnie Steinman, Dangelmayer Associates L.L.C.

Sponsors: 35th Annual EOS/ESD Symposium and Tutorials

More info to be posted. Also go to: http://esda.org/symposiaEOS-ESD.html

Time: 8:30 a.m. - 12:00 p.m.

Location: Rio All Suites, Las Vegas, NV

Speaker: Ted Dangelmayer, Dangelmayer Associates L.L.C.

Sponsors: 35th Annual EOS/ESD Symposium and Tutorials

More info to be posted. Also go to: http://esda.org/symposiaEOS-ESD.html

Time: 1:00 p.m. - 4:30 p.m.

Location: Rio All Suites, Las Vegas, NV

Speaker: Ted Dangelmayer, Dangelmayer Associates L.L.C.

Sponsors: 35th Annual EOS/ESD Symposium and Tutorials

More info to be posted. Also go to: http://esda.org/symposiaEOS-ESD.html

Time: 9:00 a.m. - 9:50 a.m.

Location: Rio All Suites, Las Vegas, NV

Speaker: Terry Welsher; Dangelmayer Associates L.L.C.

Sponsors: 35th Annual EOS/ESD Symposium and Tutorials

More info to be posted. Also go to: http://esda.org/symposiaEOS-ESD.html

Time: 9:00 a.m. - 9:50 a.m.

Location: Rio All Suites, Las Vegas, NV

Speaker: Ted Dangelmayer, Dangelmayer Associates L.L.C.

Sponsors: 35th Annual EOS/ESD Symposium and Tutorials

More info to be posted. Also go to: http://esda.org/symposiaEOS-ESD.html

Time:10:20 a.m.-12:00 p.m.

Location: Rio All Suites, Las Vegas, NV

Speaker: Arnold Steinman, Electronics Workshop and Dangelmayer Associates

Sponsors: 35th Annual EOS/ESD Symposium and Technical Sessions

More info to be posted. Also go to: http://esda.org/symposiaEOS-ESD.html

Time:5:00 p.m. - 6:00 p.m.

Location: Rio All Suites, Las Vegas, NV

Speaker: Terry Welsher, Dangelmayer Associates L.L.C., Leo G. Henry, ESD/TLP Consultants, L.L.C.

Sponsors: 35th Annual EOS/ESD Symposium and Tutorials

More info to be posted. Also go to: http://esda.org/symposiaEOS-ESD.html

Time:8:30 a.m. - 4:30 p.m.

Location: Rio All Suites, Las Vegas, NV

Speaker: Terry Welsher and Ted Dangelmayer, Dangelmayer Associates L.L.C.

Sponsors: 35th Annual EOS/ESD Symposium and Tutorials

More info to be posted. Also go to: http://esda.org/symposiaEOS-ESD.html

Time:5:00 p.m. - 6:00 p.m.

Location: Rio All Suites, Las Vegas, NV

Speaker: Terry Welsher, Dangelmayer Associates L.L.C., Leo G. Henry, ESD/TLP Consultants, L.L.C.

Sponsors: 35th Annual EOS/ESD Symposium and Tutorials

More info to be posted. Also go to: http://esda.org/symposiaEOS-ESD.html

May 2013

Time: 8:30 a.m. - 12:00 p.m. Eastern Time

Location: Teradyne Conference, North Reading, MA

Speaker: Terry Welsher, Dangelmayer Associates L.L.C.

Sponsors: Northeast Regional Tutorial Program. Cosponsored by the Northeast Chapter ESD Association

Electrical overstress (EOS) is a major cause of device failure in manufacturing and in the field. Despite this, there is relatively little information on the sources of EOS and on prevention practices, particularly for the factory. In this tutorial, the fundamentals of device overstress are reviewed. Relationships among device EOS stressing models, such as the Wunsch-Bell curve, are discussed. The causes of EOS and EOS-like events in manufacturing are described and categorized by source and by stresstype. The difficulties in distinguishing between power-induced EOS and high current ESD events such as charged-board events (CBE) and cable discharge events (CDE) are discussed. Case histories, including failure analysis and root cause determination, are presented and the few relevant industry specifications are reviewed.

Time: 8:30 a.m. - 4:30 p.m. Eastern Time

Location: Teradyne Conference, North Reading, MA

Speaker: Ted Dangelmayer, Dangelmayer Associates L.L.C., Carl Newberg, MicroStat Laboratories, Dangelmayer Associates L.L.C.

Sponsors: Northeast Regional Tutorial Program. Cosponsored by the Northeast Chapter ESD Association

Compliance verification is one of the most important elements of ESD program management and there are many technical and administrative pitfalls that can be avoided. The attendee will learn not only how to make valid auditing measurements in accordance with ESD TR53 - Compliance Verification of ESD Protective Equipment and Materials, but also how to recognize and avoid common pitfalls. Common instruments will be explained as well as the invalid test results that can result when they are used incorrectly. Advanced auditing techniques will also be covered that enable Class 0 devices to be handled successfully. There are many ways to administer effective Compliance Verification programs. Two successful examples will be presented that were developed independently by different companies. Hidden administrative pitfalls that often result in poor compliance will also be discussed. This tutorial will be highly interactive with live demonstrations, in-plant photographs, and compelling video clips. Students will be encouraged to ask questions and to participate in the discussions

This class is part of the Program Manager Certification curriculum. Details on Professional Certification offered by ESDA are on our website at www.esda.org/certification.html.

Time: 8:30 a.m. - 4:30 p.m. Eastern Time

Location: Teradyne Conference, North Reading, MA

Speaker: Ted Dangelmayer, Terry Welsher, Dangelmayer Associates L.L.C.

Sponsors: Northeast Regional Tutorial Program. Cosponsored by the Northeast Chapter ESD Association

This tutorial provides the foundation material for understanding electrostatics and ESD and their role in the manufacturing and handling of ESD sensitive devices. The fundamental properties of charge, electric fields, voltage, capacitance, and current are discussed with a view towards understanding key electrostatic phenomena and electrical processes. These include charge generation and decay, material properties, and induction. An overview of device failure mechanisms is presented, including how these models impact ESD control programs. Finally, the course provides an overview of ESD control procedures during handling and manufacturing and an overview of ANSI/ESD S20.20 program requirements. This full day course is required for those in-plant auditors and program managers who are working toward professional ESD certification. The presentation includes many in-class demonstrations, videos, and animated slides. Some sample topics covered in this course are:

• Definitions and relationships among important electrical and mechanical properties
• Causes of charge generation and decay
• Field effects and voltages
• Role of capacitance in ESD (Q=CV)
• Overview of key measurements including common pitfalls of some measurements
• Review of ESD failure models
• Understanding and demonstrating electrostatic induction
• Utility and limitations of air ionization
• Basic goals of ESD controls
• Properties of effective ESD control products and materials
• Overview of ANSI/ESD S20.20 ESD program development requirements

This class is part of the Program Manager Certification curriculum. Details on Professional Certification offered by ESDA are on our website at www.esda.org/certification.html.

March 2013

Time:TBA Eastern Time

Location: MIT Lincoln Laboratory, 244 Wood Street, Lexington, MA 02420

Speaker: Dr. Terry Welsher- Sr. V.P., Dangelmayer Associates

Sponsors: IEEE Joint Section Reliability Chapter & ESD Association North East Chapter

Meeting link & announcement will be posted on the chapter website following the Feb. Monthly meeting

Abstract: Joint IEEE & ESDA Northeast Chapter

Electrical Overstress (EOS), the Sources and Solutions by Dr. Terry Welsher

The class of device failures typically called Electrical Overstress (EOS) has been getting increased attention in the last two years. Historically, the effects of ESD on integrated circuits, particularly handling in the factory, have received much attention in technical literature, standards bodies and educational workshops and tutorials. This has been a largely successful endeavor by the industry. As a result, in many companies EOS has become the next layer of the onion to pursue. Common device design practices have not been developed to nearly the same extent; system level approaches tend to be ad hoc, and responsibility for controlling potential sources in manufacturing tends to be diffused or non-existent.

In this presentation will be description and discussion of the differences and similarities between ESD and EOS caused by other sources (excessive voltage, current or power). The current state of EOS prevention will be reviewed and examples and case histories given. Also covered will be ESD events that can be misdiagnosed as power-induced EOS (Charged-Board and Cable Discharge Events). Recent work in standards organizations and other industry groups will be reviewed and some mitigation techniques are presented.

Instructor: Ginger Hansel , Dangelmayer Associates

Online Training

Device stress testing online courses will begin January 2013!

Official ESDA Link: Go to the ESDA.org site for more course info

January 2013

Instructor: Terry Welsher, Dangelmayer Associates

Online Training

Device stress testing online courses will begin January 2013!

Official ESDA Link: Go to the ESDA.org site for more course info

Instructor: Terry Welsher, Dangelmayer Associates

Online Training

Device stress testing online courses will begin January 2013!

Official ESDA Link: Go to the ESDA.org site for more course info

December 2012

Time: 6:00 - 8:30PM Eastern Time

Location: MIT Lincoln Laboratory, 244 Wood Street, Lexington, MA 02420

Speaker: Ted Dangelmayer, Dangelmayer Associates

Sponsors: IEEE Joint Section Reliability Chapter & ESD Association North East Chapter

November 2012

Time: 2 PM Eastern Time

Location: Online Training – Webinar

Instructor: Ted Dangelmayer, Dangelmayer Associates

More Info: Nov15_2012CommonESDMyths.pdf

Course Description
Join us for this interactive webinar presented by Ted Dangelmayer to learn more about the most Common ESD Myths, the misplaced confidence, and unnecessary costs they create.

There are a number of common misunderstandings that can have significant impact on costs, quality and reliability of the ESD program. Some of these misunderstandings or "myths" result in costly unnecessary expenditures; others result in a compromise of the program integrity. These same myths are often cited by skeptics not wanting to adhere to standard ESD procedures. As a consequence, it is important to identify and dispel these myths.

Join us for this highly interactive discussion and learn about common myths such as:

Myth: Circuit Boards are Less Sensitive to ESD than Devices
Myth: HBM Data Are Sufficient for Determining Device Sensitivity Levels
Myth: MM Is A Valid Simulation Related To Machines
Myth: Air Flow Causes Charging
Myth: Metalized or Highly Conductive Shielding Layers Are Essential
Myth: Humidity Control is Essential for ESD

October 2012

Time: 11:00 AM-12:30 PM Eastern

Location: Online Training – Webinar

Instructor: Terry Welsher, Dangelmayer Associates

Course Description

EOS Update- Sources & Solutions

Electrical Overstress (EOS), the sources and solutions. Find out when and how it differs from or is similar to ESD.

The class of device failures typically called Electrical Overstress (EOS) has been getting increased attention in the last two years. Historically, the effects of ESD on integrated circuits, particularly handling in the factory, have received much attention in technical literature, standards bodies and educational workshops and tutorials. This has been a largely successful endeavor by the industry. As a result, in many companies EOS has become the next layer of the onion to pursue. Common device design practices have not been developed to nearly the same extent, system level approaches tend to be ad hoc and responsibility for controlling potential sources in manufacturing tends to be diffused or non-existent.

In this seminar, we discuss the differences and similarities between ESD and EOS caused by other sources (excessive voltage, current or power). The current state of EOS prevention is reviewed and examples and case histories are given. We also explore ESD events that can be misdiagnosed as power-induced EOS (Charged-Board and Cable Discharge Events). Recent work in standards organizations and other industry groups is reviewed and some mitigation techniques are presented.

September 2012

Time: 8:00 am - 5:00 pm, 6:00 pm - Reception

Location: Holiday Inn Boxborough Conference & Convention Center, 242 Adams Place, Boxborough, MA, 01719, Phone 978-263-8701

Restronics Seminars Presentations Title and Abstracts: PDF Document

July 2012

Time: 8:00 am - 5:00 pm

Location: Gloucester MA

Instructors: The ESD Dream Team & two invited speakers: Dave Long, Staticworx and Mark Hogsett, Simco-Ion

More Info: dangelmayer.com/DA 2012 Class 0 Best Practices Workshop 2012-04-10.pdf

Workshop Description
2012 ESD Workshop. Two invited Speakers and a fourth day. Hands-on ESD Workshop with the Dream Team: Basic and Advanced Principles. Introductions – Beyond S20.20, The Latest ESD Trends – Wafers, Devices, Boards, & Systems, Auditing Measurement Pitfalls, ESD Flooring Safety & Walking Voltage Test Methods for S20.20, ESDA TR53 Test Methods & Troubleshooting, CDM Compliance Verification, Ionization for Class 0, Advancements in CBE (Charged Board Event) & CDE (Cable Discharge Event), How Do You Know Your Program is Working?, ESD Programs for a Lab Environment, Packaging S541 Standard Review - Pros and Cons, Overview - Advanced Measurements, Correlating Event Amplitudes with Device Sensitivity, A Process Monitoring Breakthrough In-Situ CDM Event Simulation (New Technology), Oscilloscope Current Probe Measurements Contact Voltmeter Measurements Event Detection – compare to advanced equipment, Class 00 (Sub 125V Controls), Ultra-Sensitive Device/Board Controls Avoiding High Failure Rates (up to 100%)

June 2012

Time: 11:00 a.m. Eastern Time

Location: Online Training – Webinar

Instructor: Ted Dangelmayer, Dangelmayer Associates

More Info: http://esda.org/onlinecourses.html

Course Description
Learn how to prepare for the inevitable trend toward ultra-sensitive components (Class 0) that is sweeping the electronics industry and the wide spread lack of understanding about CDM (Charged Device Model) that is making it more difficult. Case studies will illustrate how CDM failures can persist even with a robust HBM program in place. A series of photographs of common CDM issues in manufacturing will enable students to visualize how to implement CDM controls. A brief summary of the work by the Industry Council on ESD Target Levels will be included. It is no longer business as usual and it can take up to two years to prepare (example - equipment retooling etc.). Are you skeptical about this news of a Class 0 trend? Is it really happening this time? Is it likely to be a problem in your factory? How big a problem is CDM in manufacturing? What is different about CDM controls? Join us for this highly interactive tutorial and get the answers to your questions.

Time: 2 PM Eastern Time

Location: Online Training – Webinar

Instructor: Arnie Steinman, Dangelmayer Associates

More Info: Methods for Determining the Impact (PDF)

Course Description
Many ESD Association standards test a property of a static control method, rather than showing the effect of using the method on production problems. This webinar discusses how to determine if using a static control method has any impact on static problems. It starts by examining static problems, ESD damage to ICs, contamination affecting semiconductor yields, and ESD-related EMI affecting equipment performance. Common test methods and equipment used to identify these problems will be discussed to show their applicability in determining the impact of a static control method on the problem.

Focusing on production equipment, this webinar will consider examples of test methods applied to the final test of ICs, particle testing for contamination of semiconductor wafers, and equipment uptime studies. The webinar will note the importance of statistical analysis of the test results, giving an example of how it was applied in a contamination control study of semiconductor production equipment. The goal of the webinar is to demonstrate that normal production test methods are a consistent source of information about the effects of a static control program.

May 2012

Time: 8:00 AM - 5:00 PM

Location: Ramada Seoul Hotel, 112-5, Samsung-dong, Gangnam-gu, Seoul, Korea

Instructors: Terry Welsher, Dangelmayer Associates, Yong Hoon (Joshua) Yoo, Core Insight, Charvaka Duvvury, Texas Instruments

More Info: http://www.cvent.com/events/

On-Chip ESD Protection Design Overview and Practical Examples Objective: The course objective is to give an overview about the importance of ESD to the electronics industry; review the protection design techniques based on device understanding and circuit performance impact, define options for protection designs, provide simulation methods, and summarize the state-of-the-art technology trends and the challenges for maintaining ESD reliability. Part I will establish the fundamental ESD aspects followed by an overview of ESD design techniques and device effects leading to the latest technologies. Part II will address more practical design methods with a focus on active rail clamp based ESD protection.

Time: TBA

Location: Priory Corsendonk, Oud Turnhout, Belgium

Moderator: Terry Welsher, Dangelmayer Associates

More Info: http://www.esda.org/iew.htm

How can we change the current way of working to include statistics of ESD events and product failure? HBM and CDM ESD thresholds have been useful as “figures of merit” to drive improvements in protection circuits. However, the relationship of these thresholds to actual quality or reliability risks is not well-understood. Many users believe that the risk of failure rises dramatically when the threshold falls even a small amount below the usual threshold requirements. This discussion group will explore better ways of communicating the risk of failure to users, better measures of ESD robustness than the simple threshold value and whether it is possible to characterize an ESD manufacturing process based on measurements (auditing).

April 2012

Time: 2:00 to 3:30 pm Eastern

Location: Internet - Webinar

Moderators: by Donn Bellmore, Advanced ESD Services +, Terry Welsher and Ted Dangelmayer, Dangelmayer Associates

More Info: http://www.dangelmayer.com/Class_0_Advanced_ESD_Measurements_on_Automated_Equipment.html

Join us for this interactive joint webinar and learn how to effectively deal with measuring ESD in automated equipment.

The ESD analysis of automation equipment is complex, not well understood and often not done correctly. The escalating use of Class 0 (ultra-sensitive) devices and high failure rates has made this analysis critically important. During this webinar you will learn about today's advanced test equipment, how to more readily identify sources of ESD damage and how to rectify or prevent ESD damage including Class 0.

This webinar will be highly interactive with in-plant photographs and compelling Class 0 case studies. The photographs illustrate the details of appropriate measurements and how to avoid the numerous pitfalls. Students will be encouraged to ask questions and able to participate verbally in the discussions.

You will learn how to make valid measurements, avoid common pitfalls and how to use this data to successfully handle Class 0 sensitivities in highly automated equipment.

The Webinar format offers VoIP and phone line connections. You will be able to talk directly with our team of experts and see our cursor pointing to discussion topics and photos in the slides.

- Ted Dangelmayer
President & CEO
Dangelmayer Associates, LLC.

WHO SHOULD ATTEND
This instruction is intended for professionals who have a basic understanding of ESD and wish to learn more.

THE WEBINAR FORMAT
A live Webinar is one that you can "attend" and participate in right from your office. The savings are significant - no travel time or hassle and no travel expense. It's easy; you only need a telephone or VoIP and access to the Internet. The audio portion is delivered over the telephone or VoIP for reliable and clear sound quality. At the same time, talk with the experts as you view the speakers' Power Point presentation.

The Webinar is also interactive so you will be able to ask questions of the experts and provide comments during the course of the program. Questions may be submitted prior to the Webinar by e-mail to Vicki@Dangelmayer.com.

WEBINAR INFORMATION
Date: Thursday, April 12, 2012

2:00 pm to 3:30 pm Eastern

Dial-in instructions as well as the URL address for accessing the Webinar will be e-mailed to you in advance of the program.

WEBINAR FEES
$185 per registrant OR
$370 for two or more registrants at the same company

Please note: One registration entitles you to one telephone connection and one computer connection at one physical location. Any transmission, retransmission, or republishing of the audio or web portion of this program is strictly prohibited. International registrants may incur additional phone charges.

FOUR WAYS TO REGISTER:
Phone - 1-978-283-5156

E-mail - Complete and email the attached registration form to Vicki@Dangelmayer.com

Fax - Complete and fax the attached registration form to 1-978-282-4884

Mail - Complete and mail attached registration form to:
Dangelmayer Associates, L.L.C.
14 Butternut Lane
Gloucester, MA 01930

All registrations must be prepaid and in U.S. Dollars prior to the Webinar.